ново
CX270-S5062
2U chassis, DC-MHS architecture, up to 24x Front hot-swap 2.5" U.2 NVMe
- 2U (DC-MHS architecture)
- Dual Intel Xeon 6700 series processors, TDP up to 350W
- (32) DDR5 RDIMM, 8 channels per CPU(2DPC), up to 6400MT/s(1DPC) and 5200MT/s(2DPC)
- (8) Front hot-swap 2.5" U.2 PCIe 5.0 x4 NVMe drive bays
- (2) Rear hot-swap E1.S 9.5mm PCIe 5.0 x4 NVMe drive bays
- (2) 2280/22110 PCIe 5.0 x2 NVMe M.2 ports
- Up to (6) PCIe 5.0 expansion slots (S5062X270RAU8)
Up to (3) PCIe 5.0 x16 expansion slots (S5062X270RAU24) - (1) PCIe 5.0 x16 OCP3 NIC Mezzanine slot (NCSI supported)
- (1) 1000Base-T Dedicated Server Management port with:
- ASPEED AST2600 with IPMI 2.0 & DMTF Redfish support
- Dual BIOS & BMC
- TPM2.0 and Hardware Root of Trust module are supported as optional
Изчерпан
Безплатна доставка от €100
Promocja cenowa na model HDR-15-5
Продукт, предназначен само за професионална употреба
CX270-S5062
Описание
Application
- Cloud Computing Service
- Content Delivery Network
- AI Inference and Fine-tuning
Техническа спецификация
| Feature | S5062X270RAU8 | S5062X270RAU24 |
|---|---|---|
| Form Factor | 2U | 2U |
| Dimensions (WxHxD) | 438mm x 87mm x 764mm | 438mm x 87mm x 764mm |
| Processor | Dual Intel Xeon 6700E/6500P/6700P, up to 350W TDP | Dual Intel Xeon 6700E/6500P/6700P, up to 350W TDP |
| Socket | 2 x LGA4710 (Socket E2) | 2 x LGA4710 (Socket E2) |
| Memory | 32 DDR5 DIMM, 8 channels per CPU (2DPC), RDIMM/RIMM-3DS/MRDIMM, Max 6400MT/s (RDIMM 1DPC), Max 256GB per DIMM | 32 DDR5 DIMM, 8 channels per CPU (2DPC), RDIMM/RIMM-3DS/MRDIMM, Max 6400MT/s (RDIMM 1DPC), Max 256GB per DIMM |
| Drive Bays | 8 Front hot-swap 2.5" U.2 (4 CPU0 + 4 CPU1), 2 Rear hot-swap E1.S (CPU1) | 24 Front hot-swap 2.5" U.2 (12 CPU0 + 12 CPU1), 2 Rear hot-swap E1.S (CPU1) |
| Internal Storage | 2 x 2280/22110 PCIe 5.0 x2 NVMe M.2 (CPU0) | 2 x 2280/22110 PCIe 5.0 x2 NVMe M.2 (CPU0) |
| Expansion Slots | 2 PCIe 5.0 x16 FHFL double wide, 2 PCIe 5.0 x16 FHFL single wide, 2 PCIe 5.0 x16 FHHL single wide | 2 PCIe 5.0 x16 FHFL double wide, 1 PCIe 5.0 x16 FHFL double wide |
| Networking | 1 PCIe 5.0 x16 OCP3 NIC Mezzanine (CPU0, NCSI supported) | 1 PCIe 5.0 x16 OCP3 NIC Mezzanine (CPU0, NCSI supported) |
| RAID | NVMe RAID 0/1/5/10 (Intel® VROC key required) | NVMe RAID 0/1/5/10 (Intel® VROC key required) |
| Front I/O | 8 Hot-swap 2.5" U.2, USB 3.0 & 2.0, Power LED, UID, Reset, 4 Status LEDs | 24 Hot-swap 2.5" U.2, USB 3.0 & 2.0, Power LED, UID, Reset, 4 Status LEDs |
| Rear I/O | 2 Hot-swap E1.S, 1000Base-T Mgmt, COM USB, USB 2.0, Mini Display, Power/UID LEDs, Status LEDs | 2 Hot-swap E1.S, 1000Base-T Mgmt, COM USB, USB 2.0, Mini Display, Power/UID LEDs, Status LEDs |
| Security | Chassis Intrusion, Optional TPM2.0, Optional ASPEED AST1060 Root of Trust | Chassis Intrusion, Optional TPM2.0, Optional ASPEED AST1060 Root of Trust |
| Server Management | 1000Base-T Mgmt, ASPEED AST2600, Dual BIOS & BMC, eMMC | 1000Base-T Mgmt, ASPEED AST2600, Dual BIOS & BMC, eMMC |
| Environment | Operating 0~35°C, Non-operating -20~70°C, 5~85% RH | Operating 0~35°C, Non-operating -20~70°C, 5~85% RH |
| Power Supply | 1+1 Redundant 2700W CRPS 80PLUS Titanium | 1+1 Redundant 2700W CRPS 80PLUS Titanium |
| Cooling | 2 EVAC air cooling modules, 6 x 6056 Hot-swap Fans | 2 EVAC air cooling modules, 6 x 6056 Hot-swap Fans |
| Certification | CE, FCC (Class A) | CE, FCC (Class A) |
